On May 19, 2026, Xingyuan Jingsuan Technology (Shenzhen) Co., Ltd. and the Tsinghua University Tianjin Institute of Advanced Equipment held a signing ceremony to formalize a deep collaborative partnership. The two parties will focus on "assessing the developmental trends, future outlook, and application prospects of atomic-scale manufacturing processes for Gallium Nitride (GaN) devices tailored for humanoid robot joint modules." This agreement marks the full launch of a strategic industry-academia-research collaboration between the two entities in the cutting-edge fields of GaN chips, humanoid robot joints, and atomic-scale manufacturing.
This collaboration marks another pivotal strategic move by Xingyuan Jingsuan within its collaborative innovation framework, which integrates industry, academia, research, and application. Leveraging Tsinghua University’s world-class research capabilities in atomic-scale manufacturing, the company will accelerate the engineering application of Gallium Nitride (GaN) power and driver chips within the joint modules of humanoid robots, thereby injecting powerful momentum into the material innovation and integration processes of these core components.
